Monomer-free UP impregnating resins

Insulation class H (180 °C) and N(200°)

Dobeckan MF
Main properties
low-viscosity impregnating and trickle resin, which can be used in trickling processes, hot-dip coating or in roll-through processes
  • Monomer-free, one-component impregnating and trickle resins based on specially modified, unsaturated polyester (without reactive thinner).
  • New resin system which completely does away with the need for standard reactive thinners such as styrene and vinyl toluene. This results in a wide range of benefits regarding impregnating quality, process reliability, work safety, environmental protection as well as storage and transportation reliability.
  • Because the resins are monomer free, emissions are reduced to virtually negligible levels and complex waste air treatment is no longer necessary.
  • Dobeckan MF 8001 has a temperature index of 200 and is UL listed

UP impregnating resins

Insulation class H (180 °C) and N(200°)

Dobeckan FT / Elan-protect UP
  • Solvent-free impregnating resins based on unsaturated polyester imides (UP) for impregnating electromagnetic windings, for example, in electric motors, transformers, and reactors.
  • The base resins are dissolved with a reactive thinner (e.g. styrene, vinyl toluene) and set to their original viscosity. During curing, the reactive thinner (monomer) fully integrates with the cross-linking resin.
One-component resin systems:
The hardener is mixed with the resin component by the manufacturer in accordance with the mixing ratio. Curing is initiated and performed by applying heat.
Two-component resin systems:
The hardener must be added in accordance with the mixing ratio. Curing is initiated and performed by applying heat.

Epoxylite® 006-0841

Single component, high voltage, thermal class 180 (H) epoxy resin system

Elan-protect EP® / Epoxylite®Single component 100 % solids system, low viscosity, excellent tank stability, for use in VPI-processes, for form wound machines/ armatures up to 13,8 kV, excellent dielectric properties, high chemical resistance, UL-recognized, for thermal class 180 (H), fulfils the directives 2011/65/EU, 2003/11/EC, 2006/121/EC

Impregnating and finishing varnishes

 

Insulation class F and H

Main Properties
Aquanel®
  • Water based, solvent free
  • Impregnating varnishes: Insulation class H, UL listed
  • Finishing varnishes: Insulation class F, air-drying, also available in pigmented form
Elmotherm®
  • Solvent based
  • Impregnating varnishes: Insulation class H, UL listed
  • Finishing varnishes: Insulation class F, air-drying, also available in pigmented form

UP Trickle Resins

Dobeckan FT

       
  • Solvent free trickle resins, based on unsaturated polyester imide (UP), for the impregnation of electromagnetic windings, e.g.  in electric motors, transformers, reactors
  • The trickling process takes advantage of capillary effects inside the enamelled wire winding.
  • Advantages of trickling versus impregnating resins: very low losses through evaporation and dripping, high filling degree of the trickled objects.
  • The basic resins are dissolved using a reacting thinner (e.g. styrene,, vinyltoluene) and adjusted to their initial viscosity. The reacting thinner (monomer) will become an integral part of the reticulated resin during the hardening process.
       
Single- component resin systems:The hardener is already dissolved inside the resin component at manufacturing in the correct mix ratio. The hardening process (reticulation) is initiated and achieved through heat application.
Two-component resin systems:The hardener must be added in the correct mix ratio. The hardening process (reticulation) is initiated and achieved through heat application.

 

 

Hardeners

For epoxy casting resins
  • Elan-tron W 764: Polyaminoamide hardener for Elan-tron MC 505 and Elan-tron MC 556-05M
  • Elan-tron W 743: Acid anhydride hardener for Elan-tron MC 543

 

For PUR casting resinsIsocyanate hardener

Monomers (reactive thinners)

Styrol , VinyltoluolMonomers (reactive thinners) are used to set the optimum original viscosity of UP impregnating resins and UP trickle resins.
Due to the fact that the chemical structure of the monomers contains reactive double bonds, the monomers also cross-link with the cured resin in the polymerization reaction. This is why it is necessary to remove them from the resin by means of evaporation before curing is carried out.

PUR casting resins

Elan-tron PU 4440 with hardener Elan-tron 4900
  • Solvent-free, polyester containing hydroxyl groups with added filler. Color: dark brown. The hardener is an aromatic isocyanate.
    Color: transparent brown. The low-viscosity resinous compound comprising the two components cures at room temperature in a polyaddition reaction to form a soft, elastic polyurethane cured resin. Can be used for applications in temperature class B (130°C)

Silicon rubber casting compound

Elan-tron® 6020 
       
  • Reticulates through condensation
  • Reticulates at room temperature
  • Good thermal conductivity
  • High continuous temperature resistance
  • Operation temperatures from -40°C to 180°C
  • Elastic molded material, self-extinguishing according to
Elan-tron® SK 6020 MV
       
  • Reticulates through condensation
  • Reticulates at room temperature
  • Good thermal conductivity
  • High continuous temperature resistance
  • Operation temperatures from -40°C to 180°C
  • Elastic molded material
  • Self-extinguishing according to UL94 class H
       

 

EP casting resins

Elan-tron EC 505 with hardener W 764.1
  • Unfilled epoxy resin with polyaminoamide hardener, which cures in a polyaddition reaction to form a hard and tough, transparent cured resin.
  • Can be used for applications in temperature class E (120 °C)

Coating varnishes

ElmothermCoating varnishes protect electrical machines and electronic modules (e.g. printed circuit boards) against moisture, chemicals, dust, etc. They comprise a base resin (solid) and a solvent mixture, which can be added in variable amounts to set the correct viscosity of the coating varnish. Curing can take place at room temperature or can be accelerated by applying heat. This involves removing the solvent from the varnish by means of evaporation before the base resin (solid) cures.

Electronic coating varnishes Bectron PL 4122

Coating varnishes protect objects (e.g. printed circuit boards) against moisture, dust, etc. They comprise a base resin (solid) and a solvent mixture, which can be added in variable amounts to set the correct viscosity of the coating varnish. Curing can take place at room temperature or can be accelerated by applying heat. This involves removing the solvent from the varnish by means of evaporation before the base resin (solid) undergoes oxidative curing through exposure to atmospheric oxygen.

Bectron® PL 4122 series
  • Transparent coating varnishes based on a modified alkyd resin
  • Cures quickly at low temperatures
  • Very good dielectric properties and excellent anti-corrosive effect even when applied in very thin coats
  • Used preferably for coating printed circuit boards (in particular in automotive electronics), hybrids and SMD modules
  • Very good adhesion on printed circuit board substrates even after several changes in temperature –40°C / + 130°C
  • High temperature index of 134
  • Particularly ecologically safe because the solvents do not contain any aromatic components

Electronic coating resins Bectron PK 43..

Bectron® PK series
  • One-component, solvent-free dispersion of polyols and encapsulated isocyanates.
  • The encapsulated crystalline isocyanate hardener is mixed with the polyol component by the manufacturer in accordance with the correct mixing ratio.
  • The hardener capsules burst at temperatures in excess of 80 °C releasing the hardener allowing curing to be begin.
  • Bectron PK 43.. resins are available with different, graded intrinsic viscosities.
  • With higher intrinsic viscosities, the resin, which is applied wet, comes to a standstill immediately or relatively quickly, and can therefore be applied very accurately in easily definable layers of varying thickness. This means that printed circuit boards can be partially coated without any difficulty (selective coating, glob top applications).
  • Since the resin can be applied in thick coats and due to good edge coverage, excellent corrosion protection can be provided for the electronic components to be coated.
  • All Bectron PK 43.. resins have very good adhesive properties on virtually all materials used in the electronics industry.
  • Bectron PK 43.. resins are easy to process (e.g. no mixing required) and are not classified as dangerous substances.

 

Electronic casting resins Bectron PK 43..

Bectron® PK series
  • One-component, solvent-free dispersion of polyols and encapsulated isocyanates.
  • The encapsulated crystalline isocyanate hardener is mixed with the polyol component by the manufacturer in accordance with the correct mixing ratio.
  • The hardener capsules burst at temperatures in excess of 80 °C releasing the hardener allowing curing to be begin.
  • Bectron PK 43.. resins are available with different, graded intrinsic viscosities.
  • With low intrinsic viscosities, the resin, which is applied wet, is free-flowing and particularly suitable for void-free embedding.

Gelcoats

Dobeckan® ST 075-1714is a styrene containing filled polyester resin, which is processed in combination with the Hardener UP K 2 and after hardening shows excellent thermo-mechanical
properties. The components of this trickle resin combination fulfill the directives 2011/95/EC, 2003/11/EC and 2006/121/EC. The raw materials of these components are pre-registered under
the directive 1907/2006EC (REACH) and the formulations contain no materials in Art.57/Annex XIV 1907/2006/EC of 9.10.2008 (SVHC).

 

Thinners

Thinners for impregnating and finishing varnishes Main properties Setting the ideal application viscosity, depending on the application conditions and methods for impregnating and finishing varnishes

Special products

Detergent
  • Transparent, colorless solvent mixture for removing fluid or hardened varnish and resin residues
  • For cleaning measuring apparatus, tools and system components with layers of
    • impregnating and coating varnish
    • impregnating and trickle resin
  • Leaves virtually no residue in lines or valves

 

Release agent
  • Silicone resin solution in readily volatile solvent
  • Can be used as a mould release agent and is suitable for moulds made of
    • metal (iron, aluminum, brass)
    • wood
    • plastic
  • For removing castings from resin combinations of all material groups, even with hot curing
  • The release agent is applied directly to the mould wall and distributed evenly. The release film does not need to be baked.

 

P 80 insulating adhesive varnish
  • Solvent-containing, high-polymeric plastic
  • Temperature index: 110 °C
  • High adhesive strength
  • Good resistance to transformer oil and ester fluids